CHIP PACKAGE AND METHOD FOR FORMING THE SAME

摘要

A chip package is provided. The chip package includes a substrate having a first surface and a second surface opposite thereto. A dielectric layer is disposed on the first surface of the substrate and includes a conducting pad structure. A first opening penetrates the substrate and exposes a surface of the conducting pad structure. A second opening is communication with the first opening and penetrates the conducting pad structure. A redistribution layer is conformally disposed on a sidewall of the first opening and the surface of the conducting pad structure and is filled into the second opening. A method for forming the chip package is also provided.

主权项

1. A chip package, comprising:
a substrate having a first surface and a second surface opposite thereto; a dielectric layer disposed on the first surface of the substrate, wherein the dielectric layer comprises a conducting pad structure; a first opening penetrating the substrate and exposing a surface of the conducting pad structure; a second opening in communication with the first opening and penetrating the conducting pad structure; and a redistribution layer conformally disposed on a sidewall of the first opening and the surface of the conducting pad structure and filling into the second opening.