| 摘要 |
<P>PROBLEM TO BE SOLVED: To pre-condition a sputtering target prior to use of the target in a sputtering process by removing a damaged surface layer of a sputtering surface of the target. <P>SOLUTION: In one version, the sputtering surface of the sputtering target is lapped to remove a thickness of at least about 25 microns to obtain a sputtering surface having a surface roughness average of from about 4 to about 32 microinches. In another version, an acidic etchant is used to remove the layer. In yet another version, the damaged surface layer is annealed by heating the surface. <P>COPYRIGHT: (C)2007,JPO&INPIT |
