发明名称 FINFET CONFORMAL JUNCTION AND HIGH EPI SURFACE DOPANT CONCENTRATION METHOD AND DEVICE
摘要 A method of forming a source/drain region with an abrupt, vertical and conformal junction and the resulting device are disclosed. Embodiments include forming a gate electrode over and perpendicular to a semiconductor fin; forming first spacers on opposite sides of the gate electrode; forming second spacers on opposite sides of the fin; forming a cavity in the fin adjacent the first spacers, between the second spacers; partially epitaxially growing source/drain regions in each cavity; implanting a first dopant into the partially grown source/drain regions with an optional RTA thereafter; epitaxially growing a remainder of the source/drain regions in the cavities, in situ doped with a second dopant; and implanting a third dopant in the source/drain regions.
申请公布号 US2016190251(A1) 申请公布日期 2016.06.30
申请号 US201514676912 申请日期 2015.04.02
申请人 GLOBALFOUNDRIES Inc. 发明人 FENG Peijie;PENG Jianwei;LIU Yanxiang;PANDEY Shesh Mani;BENISTANT Francis
分类号 H01L29/08;H01L29/78;H01L29/161;H01L21/8234;H01L29/24;H01L21/265;H01L21/324;H01L29/66;H01L29/167 主分类号 H01L29/08
代理机构 代理人
主权项 1. A method comprising: forming a gate electrode over and perpendicular to a semiconductor fin; forming first spacers on opposite sides of the gate electrode; forming second spacers on opposite sides of the fin; forming a cavity in the fin adjacent the first spacers, between the second spacers; partially epitaxially growing source/drain regions in each cavity; implanting a first dopant into the partially grown source/drain regions; epitaxially growing a remainder of the source/drain regions in the cavities, in situ doped with a second dopant; and implanting a third dopant in the source/drain regions.
地址 Grand Cayman KY