发明名称 ACOUSTIC WAVE DEVICE STRUCTURE, INTEGRATED STRUCTURE OF POWER AMPLIFIER AND ACOUSTIC WAVE DEVICE, AND FABRICATION METHODS THEREOF
摘要 An integrated structure of power amplifier and acoustic wave device comprises: a compound semiconductor epitaxial substrate, a power amplifier upper structure formed on a first side of said compound semiconductor epitaxial substrate, and a film bulk acoustic resonator formed on a second side of said compound semiconductor epitaxial substrate; wherein forming an epitaxial structure on a compound semiconductor substrate to form said compound semiconductor epitaxial substrate; wherein said first side of said compound semiconductor epitaxial substrate and said power amplifier upper structure form a power amplifier; said second side of said compound semiconductor epitaxial substrate and said film bulk acoustic resonator form an acoustic wave device; the integrated structure of power amplifier and acoustic wave device on the same compound semiconductor epitaxial substrate is capable of reducing the component size, optimizing the impedance matching, and reducing the signal loss between power amplifier and acoustic wave device.
申请公布号 US2016190206(A1) 申请公布日期 2016.06.30
申请号 US201414586592 申请日期 2014.12.30
申请人 WIN Semiconductors Corp. 发明人 TSAI Shu-Hsiao;LIN Re Ching;LIAO Pei-Chun;LIN Cheng-Kuo;CHIN Yung-Chung
分类号 H01L27/20;H03H9/17;H01L41/332 主分类号 H01L27/20
代理机构 代理人
主权项 1. An integrated structure of power amplifier and acoustic wave device, comprising: a compound semiconductor epitaxial substrate including a compound semiconductor substrate and an epitaxial structure formed on said compound semiconductor substrate; a power amplifier upper structure formed on a first side of said compound semiconductor epitaxial substrate, wherein said first side of said compound semiconductor epitaxial substrate and said power amplifier upper structure form a power amplifier; and a film bulk acoustic resonator formed on a second side of said compound semiconductor epitaxial substrate, wherein said second side of said compound semiconductor epitaxial substrate and said film bulk acoustic resonator form an acoustic wave device; wherein, the integrated structure of said power amplifier and said acoustic wave device on the same said compound semiconductor epitaxial substrate is capable of reducing the component size, optimizing the impedance matching, and reducing the signal loss between said power amplifier and said acoustic wave device.
地址 Kuei Shan Hsiang TW