| 摘要 |
A device including a substrate and an imaging element layer having a plurality of imaging elements is provided, where the imaging element layer is located between the substrate and a wiring layer having a plurality of wiring lines (41), and wiring lines of the wiring layer are arranged in pixel regions (Z) configured to receive light having a wavelength less than a predetermined wavelength (B, G). Accordingly, by more uniformly distributing the wiring layer throughout, it is possible to reduce an unevenness that occurs at a polishing film. Moreover, because wiring lines are not disposed in pixel regions (Z) configured to receive light having a wavelength greater than the predetermined wavelength (R), irregularities may be reduced. |
