| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tile, wherein the coefficient of thermal expansion at room temperature to 400°C is smaller than that of the conventional tiles, and warpage is not caused in a cooling process in the later period of a firing process and the rate of hydration expansion is small, and to provide its manufacturing method. <P>SOLUTION: The tile is characterized in that the tile contains 63 to 73 wt.% SiO<SB>2</SB>, 16.3 to 20.3 wt.% Al<SB>2</SB>O<SB>3</SB>, 6.5 to 8.5 wt.% CaO, 2.8 to 4.8 wt.% MgO, ≤1 wt.% Na<SB>2</SB>O+K<SB>2</SB>O, and ≥96 wt.% SiO<SB>2</SB>+Al<SB>2</SB>O<SB>3</SB>+CaO+MgO, and the coefficient of thermal expansion at room temperature to 400°C is 5.8 to 7.0×10<SP>-6</SP>/°C. <P>COPYRIGHT: (C)2007,JPO&INPIT |
