LEAD FRAME HAVING HEAT EMITTING PORTION AND LIGHT EMITTING DIODE PACKAGE USING THE SAME

摘要

A lead frame having a heat discharging portion and a light emitting diode package using the same are provided to improve the light emitting efficiency of the package and to produce the light of the high brightness for a long time by dispersing and discharging heat to the outside. A light emitting diode package includes a light emitting diode chip(110), a package main body(120), a first lead frame(130), and a second lead frame(140). The light emitting diode chip(110) is mounted in an opening(121) of the package main body(120), and generates the light having a predetermined wave length by using the current from external power supply through the first and second lead frames(130,140). The first lead frame(130) and the second lead frame(140) are electrically connected with the light emitting diode chip(110). The first lead frame(130) has a first heat emitting portion(135) in a side and a second heat emitting portion(136) in the other side. The first and second heat emitting portions(135,136) are vertically extended for a surface on which the light emitting diode chip(110) is mounted.