MICROWAVE SEMICONDUCTOR PACKAGE AND MICROWAVE SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a microwave semiconductor package capable of improving connection strength between a ceramic package and a base plate without degrading high frequency performance.SOLUTION: The ceramic package has a case formed with a space for storing a semiconductor element. The case has a concave which is formed along an outer edge on the lower face. The case also has an electrode which is formed in an area including a concave on the lower face. With this, the electrode can be strongly connected to a pad on a base plate. Accordingly, the reliability and service life of the connection part between the ceramic package and the base plate is improved.SELECTED DRAWING: Figure 1