RESIN COMPOSITION FOR FORMING UNDERLAYER FILM, LAMINATE, PATTERN FORMING METHOD, KIT FOR FORMING IMPRINT, AND METHOD FOR MANUFACTURING DEVICE

摘要

Provided are: a resin composition for forming an underlayer film, which is capable of improving mold releasability when a mold is separated from a cured product layer of a photocurable composition; a laminate; a pattern forming method; a kit for forming an imprint; and a method for manufacturing a device. This resin composition for forming an underlayer film contains a resin, a mold release agent that has at least one group selected from among ionic groups and silane coupling groups, and a solvent.