| 摘要 |
This mounting device (11) is provided with: a mounting unit (13) which executes a mounting cycle multiple times which involves collecting a component (P) from a prescribed collection position by means of a suction nozzle (24) and mounting said component (P) onto a substrate (S); a flip unit (36) which moves a plurality of components (P) from an initial position to a collection position without returning the components to the initial position; and a control unit in which, when at least some of the multiple components (P) to be collected by the suction nozzle (24) (the collection member) in one mounting cycle remain in the flip unit (36) (the transfer unit), in the case that there is subsequently a mounting cycle for collecting components (P) from the flip unit (36), then, in the mounting cycle up to the subsequent collection of components (P) from the flip unit (36), the mounting unit (13) is made to perform recovery mounting processing using said remaining components (P). |
