| 摘要 |
An electroless tin or tin-alloy plating solution which is less apt to penetrate into the interface between a cover lay film or solder resist and copper or a copper alloy, and can form a deposit film having satisfactory wettability by a solder and satisfactory reliability of connection between the base and the solder. The electroless tin or tin-alloy plating solution contains at least a tin salt, a complexing agent, and an acid, and is characterized by containing an azole compound or azine compound having three or more nitrogen atoms in the ring. |
