| 摘要 |
PURPOSE:To improve and stabilize the quality of ICs by a method wherein a suspension lead supporting an island with a bonding stage is cut and bent and an internal leads and a suspension lead left on the island side are clamped with a heater block and a work press. CONSTITUTION:In a bonding stage, an internal lead 3 and a suspension lead 4 are clamped with a heater block 5a and a work press 6a. The suspension lead 4 is first cut with a cutting blade 6a. The front end of the suspension lead is clamped and bent between itself and a die 14a. While an island 2 on which a separated semiconductor chip 1 is mounted is being fixed with a suspension lead section left on the island, wire bonding is performed. After bonding, the semiconductor chip 1 is supported on a lead frame only by a bonding wire 8, then in this state, resin sealing, diver cutting, lead cutting, and molding are performed. As a result, no passage exists where the semiconductor chip 1 and the island 2 are directly in contact with the outside air. Thus, resistance to moisture is improved and the reliability of ICs is stabilized. |
