发明名称 LAMINATION STRUCTURE IN PROCESSOR
摘要 <p>PURPOSE:To prevent warp, exfoliation, break, etc., keeping stably the lamination between two members different in thermal expansion coefficient. CONSTITUTION:A ceramic board 12 and an aluminum substrate 10 are stuck to each other by a binder 14. Grooves 20 are cut in specified patterns at the adhesive face (topside) of the aluminum substrate 10. If the aluminum substrate 10 and the ceramic board 12 are transformed at different thermal expansion coefficients, respectively, each pillar part 21 being demarcated by the grooves 20 is transformed in tangent direction, on the side of the adhesive face 10a of the aluminum substrate 10, and it releases stress. Hereby, also on the adhesive face of the ceramic board 12, stress is reduced, and the stress applied to the binder 14 is lightened, too, and the lamination between the ceramic board 12 and the aluminum substrate 10 is maintained stably.</p>
申请公布号 JPH06342842(A) 申请公布日期 1994.12.13
申请号 JP19930152710 申请日期 1993.05.31
申请人 TOKYO ELECTRON LTD 发明人 ASAKAWA TERUO
分类号 H01L21/683;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/683
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