| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin compsn. which has excellent i line transmittability and the adhesiveness to a substrate, a process for producing polyimide patterns having high adhesiveness, dry etching resistance, good resolution and dimensional accuracy and a process for producing semiconductor elements. SOLUTION: This photosensitive resin compsn. contains a polyimide precursor which has the repeating unit expressed by formula (where X denotes a quadrivalent org. group contg. a silicon atom, Y denotes a bivalent org. group and R<1> and R<2> denote photosensitive groups) and has transparency to the extent of not hindering the curing reaction by light of a wavelength 365 nm. The coefft. of thermal expansion of the film after polyimidation is specified to <=20 ppm/ deg.C. This process for producing the compsn. consists in applying such photosensitive resin compsn. on a base material, drying the coating, exposing the coating to a pattern form and removing the unexposed parts by development to obtain relief patterns, then heating the relief patterns. The semiconductor elements are produced by forming the polyimide patterns on the base material by this process for production. |
