发明名称 COMP0NENT MOUNTING APPARATUS AND SUBSTRATE TRANSFER METHOD
摘要 <p>A substrate transfer apparatus (24A) for a component mounting apparatus is provided with translatory guides (78A, 78B), and substrate holding sliders (79A, 79B). The translatory guides (78A, 78B) extend in a transfer direction (C) toward substrate receiving/transferring positions (P1, P2) and face each other at an interval (G1) in a direction orthogonally intersecting with the transfer direction (C). The substrate holding sliders (79A, 79B) are movable along the translatory guides (78A, 78B), face each other at an interval (G2) in the direction orthogonally intersecting with the transfer direction (C), and removably hold a substrate (12) by a vacuum source operating on a lower plane of the substrate. The substrate holding sliders (79A, 79B) reciprocate between the first and second substrate receiving/transferring positions (P1, P2) by an X axis driving mechanism (87) in a transfer direction of the substrate (12).</p>
申请公布号 KR20070103022(A) 申请公布日期 2007.10.22
申请号 KR20077018189 申请日期 2006.02.01
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TSUJI SHINJIRO;MURATA TAKAHIKO;FUJIWARA KEIJI;ODAWARA KOZO
分类号 H01L21/677 主分类号 H01L21/677
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