| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component that improves connection reliability. <P>SOLUTION: In a surface-mounted electronic component 10 that extends to the outside from the periphery of a package 11 and comprises an outer lead 12 to be connected to a wired pattern 21 on a printed circuit board 20 via a solder 30, a fold 12a for connecting the outer lead 12 is provided with an opening 12b (12c) open into a side at least adjacent to the solder 30. In this way, a filet 30a is formed in the inner periphery of the opening 12b (12c) provided to the fold 12a of the outer lead, so that the previous connection reliability can be improved. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
