| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thinned semiconductor device, in which an external connection terminal can be formed, and a manufacturing cost can be reduced, and to provide its manufacturing method. <P>SOLUTION: A resin layer 11, a penetration via 12 formed in the resin layer 11, a semiconductor element 16 connected electrically at one end of the penetration via 12, an external connector 18 connected at one end of the penetration via 12, and a sealing resin 17 which seals the semiconductor element 16 are provided. <P>COPYRIGHT: (C)2007,JPO&INPIT |
