| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily detect the presence of a semiconductor chip on a wafer without erroneous recognition. <P>SOLUTION: This semiconductor chip detection device detects individual separated semiconductor chips 12 on a wafer. The semiconductor chip detection device includes: a light source 10; a camera 16 facing the light source 10 by interposing a dicing sheet 14 with the semiconductor chips 12 stuck thereto, and acquiring image data by imaging the semiconductor chips 12 irradiated with light by the light source 10; a processing part 18 subjecting the image data to a binarization process; and a recognition part 20 recognizing presence of the semiconductor chip from the image data subjected to the binarization process by the processing part 18. <P>COPYRIGHT: (C)2009,JPO&INPIT |
