发明名称 VAPOR DEPOSITION METHOD AND VAPOR DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition method and a vapor deposition system where a crucible and cooling water are made needless, structure is simplified, further, injection energy is reduced, and further, the generation of splashes upon film deposition is prevented. SOLUTION: Particles 17 are evaporated from vapor deposition materials 13 provided so as to face a substrate 11 in a chamber 14 and are deposited on the surface of the substrate, so as to form a protective film on the surface of the substrate. The vapor deposition materials are floated in the air in a state of being exposed as being solid within the chamber. Concretely, the vapor deposition materials are disks each having a hole at the center. At first, the holes of a plurality of vapor deposition materials are inserted into one rod, respectively, thus they are arranged in a line. Next, the rod at which a plurality of the vapor deposition materials are arranged is inserted into the chamber, and is horizontally held. Further, the outer circumferential faces of the vapor deposition materials arranged at the tip of the rod are irradiated with a beam 16, so as to evaporate the particles from the vapor deposition materials, and, when the vapor deposition materials arranged at the tip of the rod are consumed, the vapor deposition materials arranged next are moved to the tip of the rod. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009084680(A) 申请公布日期 2009.04.23
申请号 JP20080083198 申请日期 2008.03.27
申请人 MITSUBISHI MATERIALS CORP 发明人 MAYUZUMI YOSHIYUKI
分类号 C23C14/24;C22C14/00;C22C21/00 主分类号 C23C14/24
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