Noise cancellation for a magnetically coupled communication link utilizing a lead frame

摘要

An integrated circuit package includes an encapsulation and a lead frame with a portion of the lead frame disposed within the encapsulation. The lead frame includes a first conductor having a first conductive loop and a third conductive loop disposed within the encapsulation. The third conductive loop is wound in a direction relative to the first conductive loop such that the first conductive loop is coupled out of phase with the third conductive loop. The lead frame also includes a second conductor galvanically isolated from the first conductor. The second conductor includes a second conductive loop disposed within the encapsulation proximate to the first conductive loop to provide a communication link between the first and second conductors.

主权项

1. An integrated circuit package, comprising:
an encapsulation; and a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame including a first conductor formed in the lead frame having a first conductive loop and a third conductive loop disposed within the encapsulation, wherein the third conductive loop is wound in a direction relative to the first conductive loop such that the first conductive loop is coupled out of phase with the third conductive loop, wherein the lead frame further includes a second conductor formed in the lead frame galvanically isolated from the first conductor, wherein the second conductor includes a second conductive loop disposed within the encapsulation proximate to the first conductive loop to provide a communication link between the first and second conductors.