发明名称 Doubled substrate multi-junction light emitting diode array structure
摘要 The present disclosure provides one embodiment of a light-emitting structure. The light-emitting structure includes a carrier substrate having first metal features; a transparent substrate having second metal features; a plurality of light-emitting diodes (LEDs) bonded with the carrier substrate and the transparent substrate, sandwiched between the carrier substrate and the transparent substrate; and metal pillars bonded to the carrier substrate and the transparent substrate, each of the metal pillars being disposed between adjacent two of the plurality of LEDs, wherein the first metal features, the second metal features and the metal pillars are configured to electrically connect the plurality of LEDs.
申请公布号 US9349712(B2) 申请公布日期 2016.05.24
申请号 US201514626968 申请日期 2015.02.20
申请人 EPISTAR CORPORATION 发明人 Yu Chih-Kuang;Chern Chyi Shyuan
分类号 H01L25/075;H01L27/15;H01L33/00;H01L33/62;H01L33/32;H01L33/46;H01L33/48;H01L33/50 主分类号 H01L25/075
代理机构 Muncy, Geissler, Olds & Lowe, P.C. 代理人 Muncy, Geissler, Olds & Lowe, P.C.
主权项 1. A light-emitting structure comprising: a carrier substrate having first metal features; a transparent substrate having second metal features; a plurality of light-emitting diodes (LEDs) bonded with the carrier substrate and the transparent substrate, sandwiched between the carrier substrate and the transparent substrate; and metal pillars bonded to the carrier substrate and the transparent substrate, each of the metal pillars being disposed between two adjacent LEDs of the plurality of LEDs, wherein the first metal features, the second metal features, and the metal pillars are configured to electrically connect the plurality of LEDs.
地址 Hsinchu TW
您可能感兴趣的专利