发明名称 VERY SMALL PIXEL PITCH FOCAL PLANE ARRAY AND METHOD FOR MANUFACTURING THEREOF
摘要 An imaging device includes a first semiconductor layer having a first surface and a second surface and a first photodetector having a first implanted region formed in the first semiconductor layer and a pad formed over the first implanted region. The imaging device also includes a readout circuit disposed over the first surface of the first semiconductor layer. The readout circuit has a plurality of contact plugs facing the first surface of the first semiconductor layer. The imaging device further includes a second semiconductor layer disposed below the second surface of the first semiconductor, a second photodetector having a second implanted region formed in the second semiconductor layer, and a metalized via extending through the first semiconductor layer and the second semiconductor layer and electrically connecting the second implanted region to a second of the contact plugs of the readout circuit.
申请公布号 US2016163757(A1) 申请公布日期 2016.06.09
申请号 US201615045139 申请日期 2016.02.16
申请人 DRS Network & Imaging Systems, LLC 发明人 Mitra Pradip
分类号 H01L27/146 主分类号 H01L27/146
代理机构 代理人
主权项 1. An imaging device comprising: a first semiconductor layer having a first surface and a second surface; a first photodetector having a first implanted region formed in the first semiconductor layer and a pad formed over the first implanted region, the pad having a malleable metallic material; a readout circuit disposed over the first surface of the first semiconductor layer, the readout circuit having a plurality of contact plugs facing the first surface of the first semiconductor layer, a first of the contact plugs having a first base and a first prong extending from the first base and into the malleable metallic material of the pad of the first photodetector; a second semiconductor layer disposed below the second surface of the first semiconductor; a second photodetector having a second implanted region formed in the second semiconductor layer; and a metalized via extending through the first semiconductor layer and the second semiconductor layer and electrically connecting the second implanted region to a second of the contact plugs of the readout circuit.
地址 Melbourne FL US