Wire-cut electrical discharge machining apparatus and semiconductor wafer manufacturing method

摘要

In wire-cut electrical discharge machining apparatuses that simultaneously perform a plurality of cutting processes by engaging a wire between main guide rollers at a plurality of times, a wire-cut electrical discharge machining apparatus is provided that suppresses vibrations at cutting wire sections, to enable the cutting processes under steady-state accuracy. In addition to the main guide rollers, vibration-damping driven guide rollers or vibration-damping guides are included which form a plurality of cutting wire sections where the vibrations are suppressed by guiding the wire into place, and the positions of the cutting wire sections are thereby defined with respect to nozzles.

主权项

1. A wire-cut electrical discharge machining apparatus, comprising:
a pair of guide rollers disposed in parallel and spaced apart from each other; a wire that forms a parallel wire section between the pair of guide rollers by being engaged between the pair of guide rollers at a plurality of times while separated from each other at fixed intervals, to travel with rotations of the guide rollers; a pair of vibration-damping guide rollers, disposed between the pair of guide rollers, that forms a plurality of cutting wire sections damped by making driven contact with the parallel wire section; a plurality of rotatable power feed contacts that feed power to each of the plurality of cutting wire sections; and a pair of nozzles disposed between the pair of vibration-damping guide rollers, the pair of nozzles each include an escape orifice configured to discharge machining fluid away from the rotatable power feed contacts.