发明名称 |
Contactless communications using ferromagnetic material |
摘要 |
A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils. |
申请公布号 |
US9412721(B2) |
申请公布日期 |
2016.08.09 |
申请号 |
US201414280732 |
申请日期 |
2014.05.19 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Yang Ping-Lin;Jin Jun-De;Hsueh Fu-Lung;Liu Sa-Lly;Ong Tong-Chern;Lin Chun-Jung;Kao Ya-Chen |
分类号 |
H01F5/00;H01L25/065;H01F27/28;H01F41/04;H01L23/522;H01L23/48 |
主分类号 |
H01F5/00 |
代理机构 |
Duane Morris LLP |
代理人 |
Duane Morris LLP ;Koffs Steven E. |
主权项 |
1. A method comprising:
providing a first semiconductor substrate having a first coil, forming an opening in a back face of a second semiconductor substrate having a second coil; providing a ferromagnetic core in the opening, joining the second semiconductor substrate over the first semiconductor substrate, such that the ferromagnetic core is at least partially located within a volume along which inner edges of the first and second coils lie, so as to increase a mutual inductance between the first and second coils. |
地址 |
Hsin-Chu TW |