发明名称 ACYLIC RESIN HEAT DISSIPATION FOAM SHEET
摘要 This sheet-shaped acrylic resin heat dissipation foam sheet has air bubbles, an acrylic resin (A), and heat-conducting particles (B) dispersed in the acrylic resin (A), wherein the content of the heat-conducting particles (B) in the foam sheet is 100-400 parts by mass per 100 parts by mass of the acrylic resin (A), the 25% compression strength of the foam sheet is 200 kPa or less, and the thickness of the foam sheet is 0.8 mm or less. This foam sheet has thinness and flexibility that allow the foam sheet to be used suitably in the interior of electronic equipment, and has excellent heat conductivity and insulating properties.
申请公布号 WO2016152660(A1) 申请公布日期 2016.09.29
申请号 WO2016JP58205 申请日期 2016.03.15
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 HAMADA, Masahiro
分类号 C08J9/30;C08F2/44;C08F20/18;H01L23/373;H05K7/20 主分类号 C08J9/30
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