发明名称 Light pipe insulation techniques
摘要 A circuit board module has a circuit board, a first light emitting diode (LED) mounted to the circuit board, a second LED mounted to the circuit board, and a light pipe assembly disposed adjacent the first and second LEDs. The light pipe assembly is configured to convey light from the first and second LEDs to a viewing area (e.g., a front panel, a faceplate, etc.). The light pipe assembly includes a first light pipe associated with the first LED, a second light pipe associated with the second LED, and an opaque sleeve configured to fit around at least a portion of the first light pipe and inhibit light conveyed through the second light pipe from bleeding into the first light pipe. Such a sleeve is further configurable to prevent each light pipe from inadvertently capturing light from the wrong LED.
申请公布号 US7293904(B2) 申请公布日期 2007.11.13
申请号 US20050237025 申请日期 2005.09.28
申请人 CISCO TECHNOLOGY, INC. 发明人 BEITELSPACHER DALE
分类号 F21V7/04 主分类号 F21V7/04
代理机构 代理人
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