| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin foam that is excellent in flexibility and conductivity, can be easily processed into a desired shape, and can be used as a conductive cushioning sealant capable of filling a minute clearance between highly densely packaged electronic components.SOLUTION: The resin foam has a volume resistivity of 10&OHgr; cm or less and a repulsive load of 5 N/cmor less at 50% compression. The resin foam preferably has a surface resistivity of 10&OHgr;/unit square or less and an apparent density of 0.01 to 0.15 g/cm. The resin foam preferably has an expansion ratio of 9 times or more. A cushioning sealant is provided, comprising the above resin foam. |
