| 发明名称 |
LASER PROCESSING METHOD AND LASER PROCESSING MACHINE |
| 摘要 |
In a laser processing method for carrying out hole-forming on a plate-shaped workpiece, [A] a hole is formed by laser-cutting the workpiece along an outline of the hole to be formed, [B] a laser processing head is moved with respect to the workpiece after forming the hole, and [C] a cutout piece inside the outline of the hole is dropped off by moving the laser processing head while jetting assist gas from the laser processing head to the cutout piece inside the outline. According to the laser processing method, the cutout piece generated when carrying out hole-forming by laser processing can be prevented from getting stuck in a hole. |
| 申请公布号 |
US2016297033(A1) |
申请公布日期 |
2016.10.13 |
| 申请号 |
US201415035928 |
申请日期 |
2014.11.07 |
| 申请人 |
AMADA HOLDINGS CO., LTD. |
发明人 |
IMAYA Shoichi;YAMAIZUMI Youhei |
| 分类号 |
B23K26/388;B23K26/08;G05B19/18;B23K26/142 |
主分类号 |
B23K26/388 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A laser processing method for carrying out hole-forming on a plate-shaped workpiece, the method comprising:
[A] forming a hole by laser-cutting the workpiece along an outline of the hole to be formed; [B] moving a laser processing head with respect to the workpiece after forming the hole; and [C] dropping a cutout piece inside the outline of the hole by moving the laser processing head while jetting assist gas from the laser processing head to the cutout piece inside the outline. |
| 地址 |
Kanagawa JP |
