| 摘要 |
The use of an electrically conductive composition for the adhesive bonding of an electronic component having a contact surface to a substrate having a contact surface via said contact surfaces, wherein the electrically conductive composition comprises (A) 20 to 45 vol.-% of metal particles and/or metal alloy particles, wherein the metal or metal alloy has an electrical conductivity of > 107 S/m, (B) 0 to 10 vol.-% of non-metallic particles, (C) 50 to 75 vol.-% of a curable resin system, (D) 0.05 to 10 vol.-% of at least one compound selected from the group consisting of metal oxides, metal hydroxides and metal salts of C1-C18-carboxylic acids, wherein the metal is selected from the group consisting of copper, zinc and tin, and (E)0 to 10 vol.-% of at least one additive, characterized in that at least one of the contact surfaces is a tin contact surface. |
