发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To provide the photosensitivity increasing compsn. which is free from fluctuation in quality and has a high sensitivity and excellent film characteristics by using a polyamic acid compdn. having actinic functional groups at both terminals, a specific aminoacrylate compd., an amide compd. contg. carbon- carbon double bonds polymerizable by actinic radiations, and a sensitizer having a specific absorption max. wavelength as essential components. CONSTITUTION:The photosensitive polyimide resin compsn. contains (A) the polyamic acid compd. [1] having the actinic functional groups P* at both terminals, (B) the amino acrylate compd. expressed by formula [II], (C) the amide compd. contg. the carbon-carbon double bonds polymerizable by the actinic radiations, and (D) the sensitizer having 330 to 500nm absorption max. wavelength (lambdamax) as the essential components. Since this polyamic acid [I] has the multifunctional actinic sensitive groups P* at both terminals, the crosslinking density of the exposed parts increases and since the unexposed parts have the crosslinked sensitive groups P* having good solubility, the differ ence in the solubility between the exposed parts and the unexposed parts is increased and the sensitivity is enhanced.
申请公布号 JPH0477741(A) 申请公布日期 1992.03.11
申请号 JP19900190609 申请日期 1990.07.20
申请人 SUMITOMO BAKELITE CO LTD 发明人 SASHITA NOBUYUKI;HIRANO TAKASHI;TOKO AKIRA
分类号 G03F7/038;G03F7/027;G03F7/028;H01L21/027;H01L21/30;H05K3/06 主分类号 G03F7/038
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