发明名称 |
Metallization compositions for BI and PB-containing ceramic dielectrics |
摘要 |
It has been newly determined that in a reaction of an Ag/Pd metallization with Pb from a lead-based ceramics, a maximum solubility of Pb is observed of approximately 14% (atomic percent). By inclusion of an effective amount of Pb in the Ag/Pd metallization, leaching of Pb from a Pb-based ceramic is either reduced or eliminated. Thus, upon firing, the metallization exhibits an equilibration which prevents Pb from being drawn out of the underlying ceramic. Similarly, Ag/Pd metallization shows a maximum solubility of 16 atomic percent for Bi in Bi-based ceramics. Inclusion of an effective amount of Bi in the metallization prevents a Bi leaching from an underlying ceramic.
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申请公布号 |
US5391223(A) |
申请公布日期 |
1995.02.21 |
申请号 |
US19930110039 |
申请日期 |
1993.08.20 |
申请人 |
THE PENN STATE RESEARCH FOUNDATION |
发明人 |
DOUGHERTY, JOSEPH P.;WANG, SEA-FUE;HUEBNER, WAYNE |
分类号 |
C04B41/51;C04B41/88;H01G4/008;(IPC1-7):C23C20/04 |
主分类号 |
C04B41/51 |
代理机构 |
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代理人 |
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地址 |
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