发明名称 |
Method and apparatus for electrically connecting an electronic part to a circuit board |
摘要 |
A method of mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed. It includes a process of forming a conductive layer on the surface of the terminal portion; a process of forming, on the surface of the connection portion, a conductive layer having a melting point different from that of the conductive layer formed on the surface of the terminal portion; and a process of melting the conductive layer having a low melting point in such a state that the conductive layer of the terminal portion is contacted with the conductive layer of the connection portion, thereby fusing the conductive layer having a low melting point onto the conductive layer having a high melting point. Moreover, the method includes a process of forming a projecting portion made of a heat-resisting material on the surface of the electronic part around the terminal portion, and forming a conductive layer at least one surface of the connection portion or the terminal portion; and a process of electrically connecting the connection portion with the terminal portion and allowing the projecting portion to be contacted with the surface of the board.
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申请公布号 |
US5477419(A) |
申请公布日期 |
1995.12.19 |
申请号 |
US19940226049 |
申请日期 |
1994.04.11 |
申请人 |
SONY CORPORATION |
发明人 |
GOODMAN, THOMAS W.;FUJITA, HIROYUKI;MURAKAMI, YOSHIKAZU;MURPHY, ARTHUR T. |
分类号 |
H01L21/60;H05K3/30;H05K3/34;(IPC1-7):H05K7/02 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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