| 摘要 |
<p>PURPOSE: To obtain a high frequency integrated circuit device for mobile communication, e.g. portable telephone, which can be constituted even of a circuit consuming high power because of low. thermal resistance while reducing the size and the labor required for manufacture. CONSTITUTION: A chip device 3 is arranged on the surface of a multilayer ceramic board 2 having a recess 12 in which a semiconductor chip 1 is set. The wiring pattern of bias circuit and high frequency matching circuit requiring low resistance is widened and three-dimensional circuit structure is formed on the surface layer or inner layer of the multilayer ceramic board 2. In such high frequency integrated circuit device, the semiconductor chip 1 being set in the recess is connected with an intermediate plane in the recess through a connecting means, i.e., a wire, and a potting resin 7 for covering them is placed in the recess 12 without bulging outward from the surface of the multilayer ceramic board 2. A protective coat material 16 is applied onto the chip device 3.</p> |
