| 摘要 |
PROBLEM TO BE SOLVED: To correspond a wiring member to the multiterminal structure of a semiconductor element, to enhance the reliability of the wiring member to an electrical connection and to enable high-density mounting of the wiring member, by a method wherein an electrodeposited resin layer is cured, a base region part used as a base is formed by curing the resin layer, a conductive base material is etched to separate a wing part and the base resin part from one surface of the conductive base material. SOLUTION: An electrodeposited resin layer 130 is provided, in such a way as to cover wiring parts 120 by electrodeposition, the layer 130 is cured and a resin part formed by curing the layer 130 is used as a base. Then the layer 130 is subjected to perforating work, so that the region only of each one part of the parts 120 is made to expose. Then Cu-plated layers 140 are filled in hole parts 135 by plating on the parts 120 exposed by the perforating work, in such a way as to reach up to the surface of the layer 130 located on the opposite side to the side of a conductive substrate 110 and are formed, in such a way as to rise to the outside. Then the substrate 110 only is etched away and an interposer for mounting a flip-chip on a wiring board is formed separately from the substrate 110. |
