| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device capable of restraining deterioration of a polishing rate and uneven polishing by restraining deterioration of a press-down pressure near a peripheral edge of a wafer. <P>SOLUTION: This polishing device 10 comprises a polishing pad 11 polishing a wafer 12, and a polishing head 13 holding the wafer 12. The polishing head 13 has a retainer ring 16 holding the wafer 12 in an in-plane direction, a membrane sheet 17 pressurizing the wafer 12 on the polishing pad 11 side, and a head body 14 supporting the retainer ring 16 and the membrane sheet 17. The retainer ring 16 has a ring-like retainer 20 with approximately the same thickness as the wafer 12 to be polished having an inner edge holding a peripheral edge of the wafer 12 in the in-plane direction, and retainer bodies 21a, 21b holding the peripheral edge of the auxiliary retainer 20. The membrane sheet 17 has a diameter larger than that of the wafer 12, and pressurizes the wafer 12 and the vicinity of the inner edge of the auxiliary retainer 20 toward the polishing pad 11. <P>COPYRIGHT: (C)2008,JPO&INPIT |
