| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a low-cost manufacturing method by which defective products due to sinking of ends of inner leads occurring at the time of insert molding of a resin hollow package are prevented with curbing manufacturing costs and without deteriorating moisture resistance. <P>SOLUTION: Occurrence of defective products is suppressed by performing insert molding with holding only lead pins of the critical length or more most susceptible to sinking by projections provided on a molding tool, in such a manner that ends of inner leads abut on shelves of the molding tool opposed to them. A molding resin layer for separating grooves or notches formed by the projections 25 provided on the molding tool from a hollow part is designed in such a manner that its thickness is larger than other molding resin layers which form the resin hollow package. Since the moisture resistance of the resin hollow package is determined by the thinnest part of the molding resin layers, the moisture resistance is not deteriorated if the molding resin layer separating the grooves or notches formed by the projections 25 provided on the molding tool is not the thinnest of the resin hollow package. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
