| 摘要 |
PROBLEM TO BE SOLVED: To provide a splitting method of a wafer capable of splitting the wafer without dropping transverse rupture strength of an individually split chip. SOLUTION: The splitting method of wafer includes a protective tape sticking step of sticking a protective tape 3 to the surface of the wafer 2; a wafer holding step of holding the wafer 2 on the side of the protective tape on a chuck table 41; an alteration layer forming step of forming an alteration layer inside the wafer 2 by irradiating a laser beam of a wavelength permeable to the wafer 2 from the rear of the wafer 2 along an expected splitting line; a wafer carry-out step of sucking and holding the rear face of the wafer 2 by a suction pad 5 having a porous resin layer 55 on a sucking surface for carrying the wafer 2 out; a wafer supporting step of holding the surface of the wafer 2, also removing the suction pad 5 from the rear of the wafer 2, and sticking an adhesive tape to the rear of the wafer 2; and a wafer fracture step of fracturing the wafer 2 along the expected splitting line by causing external force to work on the wafer 2. COPYRIGHT: (C)2007,JPO&INPIT |
