发明名称 MULTILAYER CERAMIC SUBSTRATE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate which can prevent breakage from a snap line for a splitting groove before baking or breakage from a splitting groove after baking, and to provide its manufacturing method. SOLUTION: The multilayer ceramic substrate 10 is provided with an assembly 12 of a plurality of ceramic packages 11 formed of pieces at the central part of a square large insulating substrate made of a plurality of layers, a dummy part 13 in the outer periphery, and a plurality of splitting grooves 14 and 14a in the vertical and horizontal directions of both main faces facing each other to remove the dummy part 13 and divide the assembly 12 into pieces. In this case, a first dummy groove 15 parallel to the splitting groove 14a as an external shape of the assembly 12 is provided in the dummy part 13 on one main face of the large insulating substrate, and a second dummy groove 16 parallel to the splitting groove 14a as an external shape of the assembly 12 is provided in the dummy part 13 on the other main face thereof. In addition, the second dummy groove 16 is located at positions not facing the first dummy groove 15 on both main faces. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007243088(A) 申请公布日期 2007.09.20
申请号 JP20060066959 申请日期 2006.03.13
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 IKEDA TAKUJI
分类号 H05K3/46;B28B11/14;H01L23/12;H01L23/13;H05K3/00 主分类号 H05K3/46
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