| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board in which an interlayer adhesive agent is completely removed from a gap between a conductor post and a connection pad, and an inner circuit is hardly distorted, and to provide a circuit board and its manufacturing method. SOLUTION: The method of manufacturing the circuit board 20 comprises processes of laminating and bonding a first board 16 with a conductor post 14, and a second board 18 with a conductor pad 17, which receives conductor post 14 with an interlayer adhesive agent 13 and electrically connecting the conductor post 14 and the conductor pad 17 to each other. The circuit board manufacturing method comprises a bonding process in which lamination and bonding are carried out in such a manner that the conductor post 14 and the conductor pad 17 are heated at temperatures of 230°C to 280°C, compressed by a pressure of 0.5 to 3 MPa, and subject to metallic bonding. COPYRIGHT: (C)2007,JPO&INPIT |
