发明名称 WIRE POSITIONING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wire positioning device capable of precisely and accurately positioning a wire in a traveling passage for improving the machining accuracy and extending operation life thereof, by providing a guide portion of diamond chip and highly precisely narrowing down a positioning through-hole to a very small diameter for improving wear resistance. <P>SOLUTION: In this wire positioning device, split type guide bodies are provided, an introduction portion and a guide portion are formed at an abutting portion by having the guide bodies engaged, and a wire is routed along a traveling passage via the through hole from the introduction portion to the guide portion. By utilization of a guide body structure, a structure of the through-hole provided on the diamond chip, and a fixing means of the guide portion onto the guide body portion, the wire can be precisely and accurately positioned, thereby improving the machining accuracy and extending the operation life of the wire positioning device. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008023668(A) 申请公布日期 2008.02.07
申请号 JP20060199930 申请日期 2006.07.21
申请人 SODICK CO LTD 发明人 YOSHIDA SHINICHI
分类号 B23H7/10 主分类号 B23H7/10
代理机构 代理人
主权项
地址