| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of miniaturizing a mounting substrate, while preventing the contamination of an electrode pad due to an underfill material. <P>SOLUTION: The semiconductor device 10 includes: a first semiconductor chip 11 as the mounting substrate where an electrode pad 14 is formed around a chip mounting region; a second semiconductor chip 12 mounted by flip chip on the chip mounting region; and the underfill material 15 injected between the first and second semiconductor chips 11, 12. The electrode pad 14 is formed as a dam for preventing the effluence of the underfill material 15. By the configuration, the first semiconductor chip 11 is miniaturized. Furthermore, the electrode pad 14 functions as the dam. Consequently, the effluence of the underfill material 15 is prevented on the surface of the electrode pad 14, so as to secure reliability in bonding concerning bonding wire. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
