发明名称 ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a small-sized and low-price electronic circuit device provided with a pair of substrates arranged as upper and lower substrates with an area surrounding the lower substrate filled with a filler, assuring high and reliable vibration-proof characteristic of the upper substrate. <P>SOLUTION: The electronic circuit device includes the lower substrate 5 on which a principal circuit is formed, the upper substrate 6 on which a drive control circuit for controlling drive of the principal circuit is formed, and a resin case 3 having external lead terminals 9 of the principal circuit and the drive control circuit at the external surface of the circumferential edge and having a substrate storage space inside of the circumferential edge. In order to constitute the electronic circuit device where the upper substrate 6 is located above the lower side substrate 5 and the upper space of the lower side substrate 5 is filled with the filler, resin is used as the filler, a supporting material 2 fixed to a position above the lower side substrate with the hardened resin is provided and the upper substrate 6 is fixed with this supporting material 2. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008166358(A) 申请公布日期 2008.07.17
申请号 JP20060351622 申请日期 2006.12.27
申请人 AISIN AW CO LTD 发明人 AOKI KAZUO;TSURUOKA JUNJI;YASUI SEIJI;KAMATA YASUSHI;SOYANO SHIN
分类号 H01L25/07;H01L25/18 主分类号 H01L25/07
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