Method and apparatus for planarization of substrate coatings

摘要

A method of forming a coating, comprises applying a first coating to a substrate having a plurality of topographical features, planarizing a top surface of the first coating, and drying the first coating after planarizing the top surface. The first coating may be applied over the plurality of topographical features, and may be substantially liquid during application. The first coating may optionally be a conformal coating over topographical features of the substrate. The conformal coating may be dried prior to planarizing the top surface of the first coating. A solvent may be applied to the conformal coating, with the top surface of the conformal coating being substantially planar after application of the solvent. The first coating may have a planar surface prior to drying the first coating, and the first coating may be dried without substantial spin-drying by modifying an environment of the first coating.

主权项

1. A method of forming a coating, the method comprising:
applying a first coating in a liquid state to a substrate having a non-planar top surface, the first coating being applied conformally to have a non-planar top surface; first drying the first coating to a solid state with a non-planar top surface after the applying the first coating; applying a solvent to the first coating after the first drying to re-liquefy the first coating, a top surface of the first coating achieving a substantially planar state after application of the solvent; and second drying the first coating after application of the solvent, the first coating having a substantially planar top surface after drying, wherein the top surface of the first coating is planarized before second drying the first coating.