SUBSTRATE PROCESSING METHOD, STORAGE MEDIUM AND HEATING DEVICE

摘要

PROBLEM TO BE SOLVED: To perform formation of a coating film on a substrate where a pattern is formed on a surface and removal of a surface of the coating film with high uniformity in a face of the substrate by a device having a simple constitution.SOLUTION: A substrate processing method comprises: a coating process of coating a substrate where a pattern is formed on a surface with an application liquid to form a coated film; a film removal process of heating the substrate for decreasing a film thickness by vaporizing a component of the coated film; and a film curing process of heating the substrate for curing the coated film by cross-linking reaction along with the film removal process or after the film removal process, in which the processing is performed in such a manner that the film removal process is performed to make an average film thickness of the cured coated film be equal to or less than 80% of an average film thickness of the coated film before the film removal process.SELECTED DRAWING: Figure 5