Semiconductor packaging structure and method

摘要

A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.

主权项

1. A semiconductor device comprising:
a first package with a first side; a first contact located on the first side and a second contact located on the first side; a first underbump metallization in physical contact with the first contact; a second underbump metallization in physical contact with the second contact; a first post-contact material over the first contact and in physical contact with the first underbump metallization but not over the second contact, wherein the first contact, the first underbump metallization and the first post-contact material each have a different composition from each other; a first external conductive connector in physical contact with the first post-contact material, wherein the first external conductive connector comprises a single material throughout the first external conductive connector, the single material having a different composition than the first post-contact material; and a second package bonded to the second contact, wherein the first external conductive connector extends away from the first package a first distance, the second package extends away from the first package a second distance, the second distance being parallel to and less than the first distance, and wherein the second package comprises a second conductive connector in physical contact with the second underbump metallization.