Wiring board

摘要

The wiring board of the present invention includes at least one insulating layer and at least one conductor layer being alternately laminated, a semiconductor element connection pad formed on an upper surface of the insulating layer at an uppermost layer of the insulating layers, a cap connection pattern arranged so as to surround a region where the semiconductor element connection pad is formed, and at least one strip-shaped pattern extending from the semiconductor element connection pad to a region outside an end portion on the region side of the cap connection pattern. The cap connection pattern is formed by a plurality of island-shaped patterns spaced apart from one another, and the strip-shaped pattern is formed between the adjacent island-shaped patterns on the upper surface of the insulating layer at the uppermost layer.

主权项

1. A wiring board comprising:
at least one insulating layer and at least one conductor layer being alternately laminated; a semiconductor element connection pad including the conductor layer, formed on an upper surface of the insulating layer at an uppermost layer of the insulating layers; a cap connection pattern including the conductor layer, electrically connected to a metal cap with a solder, arranged so as to surround a region, in a plan view, where the semiconductor element connection pad is formed; and at least one strip-shaped pattern including the conductor layer, extending from the semiconductor element connection pad to a region outside an end portion on the region side of the cap connection pattern, wherein the cap connection pattern is formed by a plurality of island-shaped patterns spaced apart from one another, and wherein the strip-shaped pattern is formed between the adjacent island-shaped patterns on the upper surface of the insulating layer at the uppermost layer.