| 发明名称 | Semiconductor device having multiple magnetic shield members | ||
| 摘要 | A semiconductor device includes a wiring substrate, a lower magnetic shield member, a semiconductor chip, and an upper magnetic shield member. The lower magnetic shield member is provided on the wiring substrate. The semiconductor chip is provided on the lower magnetic shield member. The semiconductor chip includes a magnetic memory element. The upper magnetic shield member is provided over the semiconductor chip. The semiconductor chip is disposed between the upper magnetic shield member and the lower magnetic shield member. The lower magnetic shield member and the upper magnetic shield member are in direct contact with each other. | ||
| 申请公布号 | US9466784(B2) | 申请公布日期 | 2016.10.11 |
| 申请号 | US201514870084 | 申请日期 | 2015.09.30 |
| 申请人 | SHINKO ELECTRIC INDUSTRIES CO., LTD. | 发明人 | Arai Tadashi |
| 分类号 | H01L43/02;H01L27/22 | 主分类号 | H01L43/02 |
| 代理机构 | Rankin, Hill & Clark LLP | 代理人 | Rankin, Hill & Clark LLP |
| 主权项 | 1. A semiconductor device comprising: a wiring substrate; a lower magnetic shield member that is provided on the wiring substrate; a semiconductor chip that is provided on the lower magnetic shield member, the semiconductor chip including a magnetic memory element; and an upper magnetic shield member that is provided over the semiconductor chip, the semiconductor chip being disposed between the upper magnetic shield member and the lower magnetic shield member, wherein the lower magnetic shield member and the upper magnetic shield member are in direct contact with each other, the upper magnetic shield member comprises a top plate opposite to the lower magnetic shield member across the semiconductor chip, andleg portions extending from the top plate toward the lower magnetic shield member, and the lower magnetic shield member is in direct contact with the leg portions. | ||
| 地址 | Nagano-Shi JP | ||