| 发明名称 |
MOISTURE-CURABLE HOT MELT ADHESIVE FOR LIGHTING APPLIANCES |
| 摘要 |
An object of the present invention is to provide a moisture-curable hot melt adhesive which can substantially suppress generation of carbon dioxide bubbles by a reaction of an isocyanate compound and moisture as well as volume expansion when an uncured adhesive is heated. The present invention relates to a moisture-curable hot melt adhesive for lighting appliances comprising: an urethane prepolymer obtained by mixing a polyol compound and an isocyanate compound, a thermoplastic polyacrylic resin and an oxazolidine compound. |
| 申请公布号 |
US2016355713(A1) |
申请公布日期 |
2016.12.08 |
| 申请号 |
US201615242012 |
申请日期 |
2016.08.19 |
| 申请人 |
Henkel AG & Co. KGaA |
发明人 |
Tsuno Shingo;Dobashi Masaaki;Mosishita Takahide;Takahashi Tomonori |
| 分类号 |
C09J175/08 |
主分类号 |
C09J175/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A moisture-curable hot melt adhesive for lighting appliances comprising:
an urethane prepolymer obtained by mixing a polyol compound and an isocyanate compound, a thermoplastic polyacrylic resin and an oxazolidine compound. |
| 地址 |
Duesseldorf DE |
