| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which enables molding of different kinds of packages, and to provide a resin molding metal mold, and a lead frame.SOLUTION: In a manufacturing method of a package, a resin molding metal mold including a first cavity and a second cavity and having a pot connected to the first and second cavities is used. The manufacturing method of the package includes the steps of: clamping a workpiece with a resin molding metal mold; and supplying a resin from the pot to the first and second cavities to seal the workpiece in the first and second cavities. A first package molded in the first cavity is different from a second package molded in the second cavity.SELECTED DRAWING: Figure 1 |
