| 摘要 |
PURPOSE: To obtain a semiconductor device which can deal with high density arrangement of conductor lead and high pin count at low cost. CONSTITUTION: The semiconductor device has a plurality of wells for exposing a part of at least the wiring pad and the terminal land 13b for external connection of a conductor circuit pattern 15 having a plurality of conductor leads, and a solder resist mask layer 18 covering the conductor circuit pattern 15 integrally while supporting. Terminal lands 13b are projected, in zigzag area array, from the outer circumferential edge of an over resin mold package 17. |
